Heat transfer surface
US6571865B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 1999 |
| Grant date | Jun 3, 2003 |
| Priority date | — |
| Expiry date | Jun 18, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a heat transfer surface comprising a layer of carbon, to a heating element or condenser comprising said heat transfer surface, to a method of applying said heat transfer surface, and to a method for carrying out dropwise condensation employing said heat transfer surface.The carbon layer employed in the present invention is tetrahedral amorphous carbon and/or diamond-like carbon.In addition, the carbon layer may be a composite (eg. an alloy) of the above carbon sources with another component such as nickel, chromium or Teflon®.The heat transfer surface of the present invention permits dropwise condensation rather than film wise condensation to proceed. The surface also exhibits improved resistance to fouling such as scale build-up caused by hard water.The heat transfer surface of the present invention has particular application in kettles, washing machines, dishwashers and condensers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.