Opto-electronic device having staked connection between parts to prevent differential thermal expansion
US6572278B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2001 |
| Grant date | Jun 3, 2003 |
| Priority date | — |
| Expiry date | Aug 29, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/931
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An opto-electronic device is provided wherein an optical assembly having a first coefficient of thermal expansion is connected to a substrate having a second, different coefficient of thermal expansion. A plurality of stakes are either separately inserted or integrally formed-in the optical assembly and extend through and are adhesively bonded to passageways formed in the substrate. The stakes reduce or prevent differential thermal expansion that would otherwise occur as the device heats up during operation. The substrate may be thermally connected to a metallic housing for the device to increase transfer of unwanted heat into the ambient atmosphere.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.