Structure of a ball grid array IC socket connection with solder ball
US6572397B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 9, 2001 |
| Grant date | Jun 3, 2003 |
| Priority date | — |
| Expiry date | Jan 8, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved structure of a ball grid array IC socket connection with solder ball is disclosed. The improved structure of a Ball Grid Array IC socket connection solder ball having a plurality of conductive plates corresponding to IC pins is characterized in that the conductive plates are flexible bent plate bodies for insertion and clipping with the IC pins, and the other end of the plate body for insertion into the IC pins is formed into a branching opening for elastic alloy clipping of the solder ball so that the solder ball is securely clipped and the other end of the plate body is formed into a bending wall for insertion into the IC pin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.