Dewatered CMP polishing compositions and methods for using same
US6572449B2 · kind B2 · utility
1Cited by
25References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2001 |
| Grant date | Jun 3, 2003 |
| Priority date | — |
| Expiry date | Jul 15, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A dry solids composition is provided which may be reconstituted into a chemical-mechanical polishing composition comprising no abrasive particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.