High speed electronic assembly system and method
US6572702B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2000 |
| Grant date | Jun 3, 2003 |
| Priority date | — |
| Expiry date | Mar 17, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/1241
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Aspects of the present invention are directed to methods and apparatus for producing substrates, including printed circuit boards, in production lines. In one aspect, the present invention provides a production system, a plurality of production lines, wherein machines from one of the lines may be used to replace machines in one of the other lines. In another aspect, the present invention provides a printing system for use in circuit board production lines. The printing system includes a first printer, a second printer and a transfer station. In another aspect, the present invention provides a dispensing system for use is production lines. The dispensing system includes a shuttle conveyor system that allows parallel processing on multiple circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.