Brush force control method for a substrate cleaning apparatus
US6572710B2 · kind B2 · utility
8Cited by
13References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2002 |
| Grant date | Jun 3, 2003 |
| Priority date | — |
| Expiry date | Aug 5, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67046
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of cleaning a substrate supported on an upper end of a spindle by first positioning a brush at a fixed elevation over the substrate. Next, the spindle is moved upward to bring the substrate into contact with the brush. Thereafter, a cleaning force on the substrate caused by the brush is measured, and the spindle is moved in response to the measured cleaning force on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.