Methods for fabricating flexible circuit structures
US6572780B2 · kind B2 · utility
64Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2001 |
| Grant date | Jun 3, 2003 |
| Priority date | — |
| Expiry date | May 31, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1158
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Improved methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer or a dielectric film on a substrate, and then forming a conductive laminate on the release layer or the dielectric film. The conductive laminate may be easily separated by the substrate to eventually form a flexible circuit structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.