METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, NARROW PITCH CONNECTOR, ELECTROSTATIC ACTUATOR, PIEZOELECTRIC ACTUATOR, INK JET HEAD, INK JET PRINTER, MICROMACHINE, LIQUID CRYSTAL PANEL, AND ELECTRONIC DEVICE
US6573157B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 13, 2000 |
| Grant date | Jun 3, 2003 |
| Priority date | — |
| Expiry date | Dec 13, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R31/06
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of semiconductor devices, micromachines such as semiconductor device, narrow pitch connectors, electrostatic actuators or piezoelectric actuators, and ink jet heads, ink jet printers, liquid crystal panels, and electronic appliances, including them characterized in that short circuit due to dusts floating in the air will not take place. In a method where a silicon wafer (30) undergoes dicing to manufacture semiconductor devices (20), a groove (30a) covered by an insulating layer and spanning a dicing line is formed in the above described silicon wafer, and the silicon wafer undergoes dicing along the dicing line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.