Heat-curable, thermally expandable moulded park

US6573309B1 · kind B1 · utility

Assignee

• Henkel-Teroson GmbH · DE

Inventors

• Dirk Reitenbach · St. Leon-Rot, DE
• Xaver Muenz · Heidelberg, DE

Key dates

• Filing date: Aug 31, 2001
• Grant date: Jun 3, 2003
• Expiry date: Aug 31, 2021

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08J2463/00
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Foamable compositions which exhibit reduced surface tack and better handling characteristics are obtained through the use of specific combinations of epoxy resins. One or more solid epoxy resins are utilized together with liquid and/or semi-solid epoxy resins. The compositions, which preferably contain hollow glass microspheres, are capable of providing foams which are useful in the manufacture of reinforced structural members.