Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulse widths
US6574250B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2001 |
| Grant date | Jun 3, 2003 |
| Priority date | — |
| Expiry date | Jul 14, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A burst (50) of ultrashort laser pulses (52) is employed to sever a conductive link (22) in a nonthermal manner and offers a wider processing window, eliminates undesirable HAZ effects, and achieves superior severed link quality. The duration of the burst (50) is preferably in the range of 10 ns to 500 ns; and the pulse width of each laser pulse (52) within the burst (50) is generally shorter than 25 ps, preferably shorter than or equal to 10 ps, and most preferably about 10 ps to 100 fs or shorter. The burst (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a burst (50) of laser pulses (52) at each link (22). Conventional wavelengths or their harmonics can be employed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.