Apparatus and method of heat embossing thin, low density polethylene films
US6575089B2 · kind B2 · utility
1Cited by
12References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2000 |
| Grant date | Jun 10, 2003 |
| Priority date | — |
| Expiry date | Mar 3, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2023/0633
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
A method and apparatus for embossing plastic web materials, for instance, low density polyethylene film, have a movable, first embossing element having a plurality of male dies associated with a heat transferable member and a stationary, second embossing element having a plurality of female dies. The temperature of the heat transferable member is controllable so that the male dies can deform a range of deformable plastic materials. The stationary, second embossing element is alignable relative to the first embossing element and unheated so that the female dies are maintained at about ambient temperature during embossing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.