Injection-moulded card with decorative layer
US6575371B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2000 |
| Grant date | Jun 10, 2003 |
| Priority date | — |
| Expiry date | Feb 11, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/7224
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The invention relates to a method for producing injection-molded cards with at least one decorative layer (2, 6) which is already applied to a foil (1, 7) or an inlay before injection molding. To protect the inks used for the decoration from thermal action and/or excessive pressures and/or high mechanical stress during injection molding, the decorative layer (2, 6) is covered according to the invention with a protective layer (3, 5) before the foil (1, 7) provided with the decoration or an inlay provided with a decoration is inserted into the injection mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.