Joining of different materials of carrier for fluid ejection devices
US6575559B2 · kind B2 · utility
14Cited by
11References
49Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2001 |
| Grant date | Jun 10, 2003 |
| Priority date | — |
| Expiry date | Oct 31, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/20
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A carrier for a plurality of fluid ejection devices includes a substrate and a substructure. The substrate includes a first material and has a first side adapted to receive the fluid ejection devices and a second side opposite the first side, and the substructure is formed of a second material and joined to the second side of the substrate with a lap joint. The lap joint includes a first portion formed by a portion of one of the substrate and the substructure, a second portion formed by a portion of the other of the substrate and the substructure, and a third material interposed between the first portion and the second portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.