High toughness plate alloy for aerospace applications
US6576071B2 · kind B2 · utility
1Cited by
4References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2002 |
| Grant date | Jun 10, 2003 |
| Priority date | — |
| Expiry date | Feb 7, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22F1/057
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention is directed to highly controlled alloy composition relationship of a high purity Al—Mg—Cu alloy within the 2000 series aluminum alloys as defined by the Aluminum Association, wherein significant improvements are revealed in fracture toughness through plane strain, fracture toughness through plane stress, fatigue life, and fatigue crack growth resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.