Adhesive, bonding method and assembly of mounting substrate
US6576081B2 · kind B2 · utility
9Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1999 |
| Grant date | Jun 10, 2003 |
| Priority date | — |
| Expiry date | Nov 12, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1026
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is characterized by comprising a two-pack adhesive of an A agent selected from components, an acrylic monomer, a peroxide, a reducing agent, an epoxy resin precursor and a curing agent and containing at least one or two of the acrylic monomer, the peroxide and the reducing agent, and a B agent containing all of the remaining components which are not selected in the A agent. The use of this adhesive makes it possible to stably obtain the bonding free from a thermal stress with the excellent heat resistance and the good reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.