Curable resin compositions
US6576297B1 · kind B1 · utility
17Cited by
10References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2000 |
| Grant date | Jun 10, 2003 |
| Priority date | — |
| Expiry date | Jun 27, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K2200/0647
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A coating, sealant or adhesive composition curable at ambient temperatures of 40° C. or below comprises an epoxy resin and an amine-functional curing agent. The curing agent comprises a material containing at least two, and preferably at least three, heterocyclic secondary amine group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.