Carrier release sheet for styrene molding process and process system
US6576308B2 · kind B2 · utility
0Cited by
14References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 1999 |
| Grant date | Jun 10, 2003 |
| Priority date | — |
| Expiry date | Sep 27, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31935
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
This invention concerns a multilayer film useful as release sheet for sheet molding compounds, comprising a first skin layer, a second skin layer, a barrier layer for monomeric resins wherein the barrier layer is between the first and second skin layers and the first and second skin layers comprise a mixture of polyolefin and adhesive resin. This invention also pertains to the multilayer films method of production, as well as an SMC sheet employing the multilayer film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.