Semiconductor device
US6576381B1 · kind B1 · utility
23Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2001 |
| Grant date | Jun 10, 2003 |
| Priority date | — |
| Expiry date | Aug 10, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention alleviates the operational problems in production of flip chips and provides a semiconductor device superior in various reliabilities. The preset invention lies in an encapsulated semiconductor device comprising:(a) a polybenzoxazole resin film for chip protection, obtained by coating, on a circuit-formed chip, a positive photosensitive resin composition comprising 100 parts by weight of a polyamide and 1 to 100 parts by weight of a photosensitive diazoquinone compound, and subjecting the coated composition to patterning and curing, and(b) a bump electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.