Method for producing wiring configurations having coarse conductor structures and at least one region having fine conductor structures
US6576402B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2001 |
| Grant date | Jun 10, 2003 |
| Priority date | — |
| Expiry date | May 13, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A metal layer, an etching resist and a photoresist are successively applied to an electrically insulating substrate. Whereupon the photoresist is patterned by photolithography in such a way that it covers a pattern of the later coarse conductor structures and the entire region of the later fine conductor structures. After the uncovered etching resist has been stripped, the photoresist is removed, whereupon the etching resist is patterned with the aid of a laser beam in such a way that it has the pattern of the fine conductor structures. The coarse conductor structures and the fine conductor structures are then formed in a common etching process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.