Chip-type electronic component
US6576497B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2001 |
| Grant date | Jun 10, 2003 |
| Priority date | — |
| Expiry date | Dec 14, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A ceramic substrate having two side surfaces in a lengthwise direction and two side surfaces in a widthwise direction intersecting each other. The ceramic substrate also includes at least one flat surface in a thicknesswise direction. Internal electrode films are embedded in the ceramic substrate with film surfaces thereof extending roughly parallel to the flat surface of the ceramic substrate. External electrodes are each provided on the flat surface of the ceramic substrate toward one of the two ends of the ceramic substrate in the lengthwise direction, are electrically continuous with the internal electrode films and are formed over distances and from the two side surfaces in the widthwise direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.