Patent · US Expired

Semiconductor device having a solid state image sensing device and manufacturing method thereof

US6576940B2 · kind B2 · utility

11Cited by
4References
6Claims
0Family size

Assignee

Inventor

Key dates

Filing dateJan 25, 2001
Grant dateJun 10, 2003
Priority date
Expiry dateJan 25, 2021

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10F39/803

Abstract

In a semiconductor device having a solid state image sensing device of the present invention, a p-type well region 2a in which a plurality of unit cells, each having a photodiode PD, are formed and a p-type well region 2b in which a peripheral circuit element is formed are installed in a separated manner. Thus, it is possible to prevent a hot carrier, transition metals, etc. within the peripheral circuit region from invading the pixel region more effectively. Consequently, it becomes possible to provide a semiconductor device having a solid state image sensing device and a manufacturing method thereof, which can improve the pixel characteristic.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.