Method and apparatus for resisting probe burn using shape memory alloy probe during testing of an electronic device
US6577147B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2001 |
| Grant date | Jun 10, 2003 |
| Priority date | — |
| Expiry date | Sep 6, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2886
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe burn resistant interface apparatus and method for testing an electronic device use a probe made of a shape memory alloy which upon overheating of the probe during functionality testing of an electronic device contracts the probe to disengage the probe from a contact electrically connected to the electronic device and stop current flow through the probe. Upon cooling of the probe, engagement of the probe with the contact is reestablished. The probe in an example embodiment is a wire which has a core made of a shape memory alloy and a layer of a highly elastic metal, for example copper, on an outer surface of the core to aid return of the probe from its contracted state to its initial state upon cooling an overheated probe for reestablishing electrical connection of the probe with the electronic device being tested.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.