Integrated heat sink for different size components with EMI suppression features
US6577504B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2000 |
| Grant date | Jun 10, 2003 |
| Priority date | — |
| Expiry date | Aug 30, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated heat sink that can provide heat dissipation from multiple components mounted on a circuit board with each component having a different height dimension relative to each other is described. The heat sink has a first face on which a plurality of cooling fins are formed and a second face on which at least one pedestal is formed. The pedestal has a contacting surface to thermally couple to at least one of the multiple components to dissipate heat therefrom. The heat sink is designed to prevent a junction temperature at the contact area where the heat sink and each of the components abut one another from exceeding a maximum design value for the system. In one embodiment of the present invention, the heat sink has a groove formed in the second face. A conductive gasket is disposed in the groove and contacts a metal trace on the circuit board when the heat sink is attached to the circuit board to form a Faraday cage or EMI shield.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.