System and method of packaging a laser/detector
US6577656B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2001 |
| Grant date | Jun 10, 2003 |
| Priority date | — |
| Expiry date | Aug 6, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/0683
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention relates generally to laser/detector packages, and particularly to laser/detector packages with components that increase the accuracy and ease of laser diode positioning. In particular, the laser/detector package of the present invention includes an attachment plate having a reference surface; a header post that is perpendicular to the reference surface when attached to the reference surface; sub-mount that houses a laser diode and abuts the reference surface or a spacer, which abuts the reference surface. By abutting the reference surface or the spacer, the laser diode attached to the sub-mount is easily and precisely positioned a proper distance from the reference surface. Additionally, preferred embodiments of the invention include a marking on the sub-mount that is parallel to the reference surface and a marking that is perpendicular to the reference surface on the spacer or sub-mount. These markings further improve the ease and accuracy of positioning and repositioning the laser diode and/or sub-mount.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.