Film formation method, method for fabricating electron emitting element employing the same film, and method for manufacturing image forming apparatus employing the same element
US6579139B1 · kind B1 · utility
7Cited by
1References
53Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 11, 1999 |
| Grant date | Jun 17, 2003 |
| Priority date | — |
| Expiry date | Feb 11, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J9/027
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method, for forming a film locally on a substrate, which comprises the steps of detecting the state of the substrate employing the obtained result to calculate positional information concerning a plurality of locations at which the material for the film is to be provided to form the film, and providing the material for the film at the plurality of locations based on the positional information that is obtained for the plurality of locations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.