Apparatus and method for etching wafer backside
US6579408B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2002 |
| Grant date | Jun 17, 2003 |
| Priority date | — |
| Expiry date | Apr 22, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30604
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and a method for mounting a wafer and etching a wafer backside in an etchant solution are provided. The apparatus is constructed by a first circular disc that has a first sidewall integrally formed, a gas inlet in the first circular disc or the first sidewall, a second circular disc that has a second sidewall integrally formed for positioning inside the first circular disc and forming a first cavity therein between, a third circular disc that has a third sidewall integrally formed for positioning inside the second circular disc and forming a second cavity therein between, a gas outlet in the second circular disc for withdrawing air from the second cavity, and sealing means positioned on top of the sidewalls for providing a substantially sealed second cavity when a wafer is positioned on top of the sidewalls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.