Substrate provided with removable adhesive of polyepoxide, curing agent and microspheres
US6579588B2 · kind B2 · utility
10Cited by
21References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 26, 2001 |
| Grant date | Jun 17, 2003 |
| Priority date | — |
| Expiry date | Dec 3, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31515
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An article comprises a substrate wherein at least a portion of its surface is provided with a thermosettable adhesive composition prepared from a polyepoxide resin, a curing agent and a plurality of microspheres. The cured composition forms a semi-structural bond with said substrate which is inseparable at the use temperature and is cleanly removable from said substrate when heated to a temperature of greater than the use temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.