Fabrication method of an electronic component
US6579748B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 2000 |
| Grant date | Jun 17, 2003 |
| Priority date | — |
| Expiry date | May 17, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An object of the present invention is to present a fabrication method for electronic components that allows further reduction in the size of electronic components by making the semiconductor substrate thinner, and at the same time allows operation as an electronic circuit with no problems, and further, has a durability sufficient to endure even use in a mobile telephone. In order to attain this object, the present invention has a first application process (process S12) in which encapsulating resin is applied to the surface of the substrate on which the posts are formed, a back surface grinding process (process S18) in which the back surface of said substrate is ground, a second application process (process S20) in which an encapsulating resin is applied to the back surface of said substrate after being ground, and a separation process (process S26) in which said substrate is cut along with said encapsulating resin and at the same time individual electronic components are separated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.