Patent · US Expired

Transistor device and fabrication method thereof

US6579773B2 · kind B2 · utility

3Cited by
8References
22Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 25, 2001
Grant dateJun 17, 2003
Priority date
Expiry dateJun 25, 2021

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D62/137

Abstract

In the fabrication of a transistor device, particularly a low-voltage high-frequency transistor for use in mobile telecommunications, a method for improving the transistor performance and the high-frequency characteristics of the device is described. The method includes providing a semiconductor substrate (1) with an n-doped collector layer (5) surrounded by isolation areas (4), implanting antimony ions into the collector layer such that a thin highly n-doped layer (18) is formed in the uppermost portion of the collector layer, and forming a base on top of said thin highly n-doped layer (18).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.