Radiation curable adhesive compositions comprising block copolymers having vinyl functionalized polydiene blocks
US6579915B2 · kind B2 · utility
20Cited by
17References
43Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2001 |
| Grant date | Jun 17, 2003 |
| Priority date | — |
| Expiry date | Jan 29, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention is directed to a radiation curable adhesive composition comprising at least one vinyl modified block copolymer having a first polyvinyl aromatic block and a second polydiene block having vinyl functionality, and at least one tackifier. Optionally, the composition may comprises at least one second block copolymer that has not been vinyl modified, at least one platicizer, and at least one wax. The invention is also directed to a double-faced label formed from the composition and the method of producing said label.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.