Method and apparatus for thermally controlling multiple electronic components
US6580608B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2001 |
| Grant date | Jun 17, 2003 |
| Priority date | — |
| Expiry date | Dec 21, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus to thermally control multiple electronic components, such as field-effect transistors for voltage regulation in processors and chipsets in computers, allow more effective convective cooling by grouping the electronic components in an at least essentially closed loop configuration about a passageway which is open at both ends to permit air flow therethrough. The electronic components form respective side walls of the passageway or are in heat conducting relation with the side walls of a heat sink which forms the passageway. Mounting the electronic components to stand upright off the motherboard allows air to enter below the components and rise up through the passageway producing an increase in air speed and better convective cooling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.