Method and apparatus for cooling electronic components
US6580609B2 · kind B2 · utility
55Cited by
26References
28Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 8, 2002 |
| Grant date | Jun 17, 2003 |
| Priority date | — |
| Expiry date | Apr 8, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase fluid is drawn away from the electronic components and the vapor is condensed back into a liquid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.