Patent · US Expired

Method for aligning a spatial array of pattern pieces comprising a marker method

US6580962B2 · kind B2 · utility

10Cited by
7References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 10, 2001
Grant dateJun 17, 2003
Priority date
Expiry dateSep 19, 2021

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG06T2207/30124
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

In a method for aligning a spatial array of pattern pieces comprising a marker, a work material processing apparatus defining a support surface adapted to carry work material is provided and at least one layer of work is spread thereon. Images of said work material at a reference point and match point are captured and superimposed over one another these superimposed images being projected onto a display. One of said images of said work material at said reference point in said image of said work material at said match point is moved relative to the other to substantially align the images. The position of a matching pattern piece contained within the marker is then moved in accordance with the amount of relative movement to align the pattern of the sheet material within a boundary defined by the matching pattern piece with that defined by the reference pattern piece.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.