Apparatus for configuring and inserting component leads into printed-circuit boards
US6581274B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2000 |
| Grant date | Jun 24, 2003 |
| Priority date | — |
| Expiry date | May 24, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53183
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Apparatus having a mandrel, and a ring having an aperture therein, the ring being slidable over the mandrel. A multilead electronic component having electric leads extending therefrom is positioned atop the mandrel. The ring is pressed over the mandrel, bending the electric leads downward. When the ring is retracted, springback forces within the bent electric leads forces them against the inside of the ring; and the multilead electronic component is retained therewithin. The ring is then used, either manually or robotically, to position the component proximate a printed-circuit board with the electric leads aligned with connection apertures in the printed-circuit board. The multilead electronic component is pressed toward the printed-circuit board, forcing the leads through the connection apertures; and the ring is withdrawn for subsequent use. Another embodiment provides a pusher, which is manually or robotically slidable within the ring aperture, to press the multilead electronic component toward the printed-circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.