Method of producing shaped bodies of semiconductor materials
US6581415B2 · kind B2 · utility
10Cited by
10References
18Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 20, 2001 |
| Grant date | Jun 24, 2003 |
| Priority date | — |
| Expiry date | Oct 6, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22D23/003
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method for producing formed semiconductor articles with predefined shapes such as core tubes for CVD production of bulk polysilicon. The method is characterized by thermal spray deposition of the semiconductor material in a on a temperature controlled rotating mandrel that is shaped complementarily to the desired article shape, and by later separation of the formed semiconductor body from the mandrel by thermal contraction, melting, or chemical reduction of the mandrel size.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.