Method for heat treating PTC devices
US6582647B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1999 |
| Grant date | Jun 24, 2003 |
| Priority date | — |
| Expiry date | Sep 30, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C7/028
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method for heat treating a polymer PTC composition to increase the peak resistivity of the composition making it especially well suited for high voltage applications. A polymer PTC composition having a melting point temperature Tmp is provided. The temperature of the polymer PTC composition is increased at a rate, r1, to a temperature greater than Tmp. The temperature of polymer PTC composition is held at the temperature greater than Tmp for a predetermined period of time. Then the temperature of the polymer PTC composition is decreased to a temperature less than Tmp at a rate, r2, wherein r2 is greater than r1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.