Hot melt adhesive composition comprising homogeneous ethylene interpolymer and block copolymer

US6582829B1 · kind B1 · utility

Assignee

• H.B. Fuller Licensing & Financing, Inc · US

Inventors

• Thomas H. Quinn · Windom, US
• Janelle C. Cameron · Mendota Heights, US
• Beth M. Eichler-Johnson · Windom, US
• Michael S. Keehr · Blaine, US
• Jeffrey S. Lindquist · Maple Grove, US
• David B. Malcolm · Maplewood, US
• Kevin W. McKay · Baton Rouge, US
• Deepak R. Parikh · Lake Jackson, US

Key dates

• Filing date: Jun 30, 1999
• Grant date: Jun 24, 2003
• Expiry date: Jun 30, 2019

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31902
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A hot melt adhesive composition comprising a) from about 5 wt-% to about 50 wt-% of at least one homogeneous linear or substantially linear ethylene/alpha-olefin interpolymer characterized as having a density from 0.850 to 0.965 g/cm3; b) from about 1 wt-% to about 40 wt-% of at least one block copolymer; and c) from about 10 wt-% to about 75 wt-% of at least one tackifying resin wherein said adhesive does not fail cohesively.