Semiconductor device and method for fabricating the same
US6582991B1 · kind B1 · utility
116Cited by
7References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2001 |
| Grant date | Jun 24, 2003 |
| Priority date | — |
| Expiry date | Jun 25, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.