Perimeter anchored thick film pad
US6583019B2 · kind B2 · utility
8Cited by
19References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2001 |
| Grant date | Jun 24, 2003 |
| Priority date | — |
| Expiry date | Nov 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/099
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thick film circuit with a perimeter anchored thick film pad is provided. The thick film circuit includes a base substrate, a thick film bonding pad, and a solder mask layer. The thick film bonding pad is formed on the surface of the base substrate. The solder mask layer is also formed on the surface of the base substrate, and overlaps a portion of the thick film bonding pad in order to improve adhesion between the thick film bonding pad and the base substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.