Modulation method and apparatus for thermally analyzing a material
US6583391B2 · kind B2 · utility
11Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2001 |
| Grant date | Jun 24, 2003 |
| Priority date | — |
| Expiry date | Dec 15, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N25/4833
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for thermally analyzing a sample of a material by detecting a heat flow between the sample (7) and a heat source (1) and evaluating a functional relation between the measured heat flow (HF) and an associated temperature is based on controlling the heating power of the heat source (1) so as to cause the heat source to follow a temperature program (17) as a function of time superposed with a modulation (23) of the heating power.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.