Power component bearing interconnections
US6583487B1 · kind B1 · utility
2Cited by
15References
52Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 19, 1999 |
| Grant date | Jun 24, 2003 |
| Priority date | — |
| Expiry date | Oct 19, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power component formed in an N-type silicon substrate delimited by a P-type wall, having a lower surface including a first P-type region connected to the wall, and an upper surface including a second P-type region, a conductive track extending above the substrate between the second region and the wall. The component includes a succession of trenches extending in the substrate under the track and perpendicularly to this track, each trench being filled with an insulator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.