Head slider supporting device, disk device and suspension having thermal protection for head IC chip
US6583962B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2002 |
| Grant date | Jun 24, 2003 |
| Priority date | — |
| Expiry date | Jun 19, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B21/16
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A suspension has an extending end and the other end. A head IC chip mounting portion is provided between the extending end and the other end of the suspension. A head slider is loaded on a first surface of the suspension at a position on the side of the extending end with respect to the head IC chip mounting portion, the head slider integrally including a head. A head IC chip is mounted at the head IC chip mounting portion of the suspension. First wiring patterns extend along the suspension between a portion of the suspension, at which portion the head slider is loaded, and the head IC chip mounting portion. Second wiring patterns extend along the suspension between the head IC chip mounting portion and the other end of the suspension. The head IC chip is mounted at the head IC chip mounting portion in a condition in which a certain portion of the head IC chip is positioned on the side of a second surface of the suspension, which second surface is opposite to the first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.