Method and apparatus for managing thermal energy emissions
US6583986B1 · kind B1 · utility
12Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 2001 |
| Grant date | Jun 24, 2003 |
| Priority date | — |
| Expiry date | May 21, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/026
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A guide member for accommodating a removable module is formed from a thermally conductive material having at least one thermally conductive element to provide a new primary heat dissipation path to manage thermal energy generated by operation of the module. The guide member may also be used to guide the module into proper connection with a module connector which electrically connects the circuit on the module with other circuitry. A plurality of thermally conductive elements, such as spring fingers, ribs and fins, provide additional thermal heat dissipation paths and enhance the rigidity of the guide members.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.