Method of manufacturing a piezoelectric device
US6584660B1 · kind B1 · utility
49Cited by
7References
13Claims
0Family size
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Key dates
| Filing date | Jun 8, 1994 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Jun 8, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for making a piezoelectric device wherein residual stresses in the piezoelectric transducer element of the piezoelectric device are relieved by forming a groove or grooves extending into a thick-walled region of the peripheral wall of a ceramic substrate in the piezoelectric device. The stresses to be relieved are caused by a difference in shrinkage between the ceramic substrate and the piezoelectric transducer as a result of sintering the substrate and the transducer to form an integral product.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.