Method for making circuit board
US6584682B2 · kind B2 · utility
1Cited by
13References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2001 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Mar 20, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method 10 for making multi-layer electronic circuit boards 148, 248 having aperture 146, 246 which may be selectively connected to an electrical ground potential.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.