Mounting electronic component method and apparatus
US6584683B2 · kind B2 · utility
2Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2001 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Mar 20, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In an electronic component mounting method and apparatus, an electronic component is taken out from an electronic component feed position, a posture of the component is detected, and the component is mounted on a board based on a detected result. The method includes acquiring image data with a camera of the component from the feed position, processing acquired image data with a plurality of algorithms for detecting postures of components, and detecting a posture of the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.