Optical module using wiring lead integrated resin substrate
US6585426B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2001 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Mar 26, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical module capable of connecting signal lines to an external substrate easily without causing any degradation of the transmission characteristic is disclosed. The optical module comprises an optical element mounting block having an optical element mounting section and an optical fiber guide, and a wiring lead integrated resin substrate having a ferrule holding section, an optical element mounting block housing section, and wiring leads, where at least a part of the wiring leads are provided by signal lines in a coplanar guide structure entirely formed on the wiring lead integrated resin substrate such that a characteristic impedance does not change when the wiring leads are electrically connected to external wirings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.