Side mounted temperature probes for pressware die sets
US6585506B1 · kind B1 · utility
16Cited by
13References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2000 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Aug 8, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S425/127
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
In a temperature controlled segmented die for forming pressed containers such as plates, trays, bowls or the like including a die segment with a forming surface and an outer movable annular die member there is provided a side mounted temperature probe which extends laterally around the movable annular die member and toward the forming surface of the die segment. The apparatus is particularly useful for forming pressed paperboard containers such as paper plates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.