Grinding and polishing tool for diamond, method for polishing diamond, and polished diamond, single crystal diamond and single diamond compact obtained thereby
US6585565B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 25, 2002 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Jul 25, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A tool for grinding and polishing diamond and a method for polishing diamond in which a single crystal diamond, a diamond thin film, a sintered diamond compact and the like can be polished at low temperatures without causing cracks, fractures or degradation in quality therein. The tool and method provide a polishing operation which is easy to accomplish, provides stable polishing quality, and provides decreased costs while maintaining stable grinder performance. The grinder is formed of a main component which is an intermetallic compound consisting of one kind or more of elements selected from the group of Al, Cr, Mn, Fe, Co, Ni, Cu, Ru, Rh, Pd, Os, Ir and Pt and one kind or more of elements selected from the group of Ti, V, Zr, Nb, Mo, Hf, Ta and W. The diamond polishing method includes pushing the above stated grinder against the diamond, and rotating or moving the grinder relative to the diamond while keeping the portion of the diamond subjected to polishing at room temperature. Alternatively, the portion of the diamond subjected to polishing can be heated to a temperature within the range 100-800° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.