Adhesion process
US6585607B2 · kind B2 · utility
15Cited by
20References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2001 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Jun 20, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/545
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Disclosed is a process to increase adhesion between two adjacent layers. The process comprises roughening the surface of one layer followed by chlorination of the roughened surface and joining of the layers, or treating the surface of one layer with a silicone-based adhesion promoter and joining the layers. In one preferred embodiment the process comprises roughening the surface of one layer, followed by chlorination of the roughened surface, joining of the layers and post-treatment of the molded layers at an elevated temperature for a predetermined time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.